Honor Magic V foldable screen, camera and chipset built in a new leak

It’s the start of a new year, but the phone’s rumors and leaks continue to flow in – and here we look at more details that have emerged around the first foldable phone from Honor, Honor Magic V.

According to the well-known tipster Digital Chat Station on the Chinese social network Weibo (via Phandroid), the upcoming folding smartphone will be powered by the top Qualcomm Snapdragon 8 Gen 1 chipset.

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